Vacuum equipment related products EBEP processing device <FAP-EB/2D>
It is optimal for the processes of CVD, etching, and surface modification.
The vacuum equipment-related product, EBEP processing device <FAP-EB/2D>, is a high-speed, high-quality surface treatment device using low-pressure high-density plasma, making it ideal for CVD, etching, and surface modification processes. In the low-pressure region, it can efficiently dissociate and ionize process gases using an energy-variable electron beam, enabling the generation of high-density active species. It creates plasma states that cannot be achieved with CCP plasma or ICP plasma, allowing for precise film formation, etching, and surface modification of various materials. It supports film formation and surface modification of oxides, metals, resins, etc., with a diameter of φ100mm. Stage maturation (Max 500℃) and high-speed, high-precision processing through bias application have become easier. For more details, please contact us or refer to the catalog.
- Company：片桐エンジニアリング
- Price：Other
